標題: Miniature RF test structure for on-wafer device testing and in-line process monitoring
作者: Cho, Ming-Hsiang
Lee, Ryan
Peng, An-Sam
Chen, David
Yeh, Chune-Sin
Wu, Lin-Kun
電信工程研究所
Institute of Communications Engineering
關鍵字: MOSFET;process monitoring;RF;scribe line;test structure
公開日期: 1-一月-2008
摘要: In this brief, a miniature test structure for RF device characterization and process monitoring has been proposed. This new layout design can minimize the voltage drop across interconnects and can prevent capacitive coupling to devices. It consumes only 36% and 40% of the chip area of the conventional on-wafer and in-line test structures, respectively. The RF characteristics of the proposed test structure are shown to be in excellent agreement with those of the conventional ones.
URI: http://dx.doi.org/10.1109/TED.2007.911037
http://hdl.handle.net/11536/9807
ISSN: 0018-9383
DOI: 10.1109/TED.2007.911037
期刊: IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume: 55
Issue: 1
起始頁: 462
結束頁: 465
顯示於類別:期刊論文


文件中的檔案:

  1. 000252059000050.pdf