標題: 多層導體連線平坦化之研究---電鍍銅之電解拋光技術
Planarization Investigation of Multi-layer Interconnects---Electropolishing Technology for Electroplated Copper
作者: 馮明憲
國立交通大學材料科學工程研究所
關鍵字: 平坦化;多層連結線;電解拋光;電鍍銅;Planarization;Multilayer interconnect;Electropolishing;Electroplated copper
公開日期: 2001
官方說明文件#: NSC90-2215-E009-062
URI: http://hdl.handle.net/11536/96852
https://www.grb.gov.tw/search/planDetail?id=665679&docId=126368
Appears in Collections:Research Plans


Files in This Item:

  1. 902215E009062.pdf
  2. 902215E009062.pdf