標題: Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints
作者: Chen, Hsiao-Yun
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 1-Apr-2011
摘要: Thermomigration in Pb-free SnAg solder alloys is investigated during accelerated electromigration tests under 9.7 x 10(3) A/cm(2) at 150 degrees C. It is found that Cu-Sn intermetallic compounds (IMCs) migrate toward the cold end on the substrate side and, as a result, voids accumulate in the chip side for the bump with current flowing from the substrate end to the chip end. Theoretical calculations indicate that the thermomigration force is greater than the electromigration force at a thermal gradient above 400 degrees C/cm for this stressing condition. Copper atoms may migrate against current flow and become the dominant diffusion species. On the other hand, Ni-Sn IMCs did not migrate even under a huge thermal gradient of 1400 degrees C/cm. These findings provide more understanding on the thermomigration of metallization materials in flip-chip solder joints.
URI: http://dx.doi.org/10.1557/jmr.2011.25
http://hdl.handle.net/11536/9019
ISSN: 0884-2914
DOI: 10.1557/jmr.2011.25
期刊: JOURNAL OF MATERIALS RESEARCH
Volume: 26
Issue: 8
起始頁: 983
結束頁: 991
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