Title: 60GHZ傳送接收器之覆晶多晶片模組構裝技術與設備開發
Authors: 成維華
CHIENG WEI-HUA
國立交通大學機械工程學系(所)
Issue Date: 2006
Gov't Doc #: NSC95-2623-7009-013
URI: http://hdl.handle.net/11536/89636
https://www.grb.gov.tw/search/planDetail?id=1335931&docId=247738
Appears in Collections:Research Plans