|標題:||Self-aligned contact metallization technology for III-V metal-oxide-semiconductor field effect transistors|
Wann, Clement H.
Lim, Phyllis Shi Ya
Department of Electronics Engineering and Institute of Electronics
|摘要:||The demonstration of a salicidelike self-aligned contact technology for III-V metal-oxide-semiconductor field-effect transistors (MOSFETs) is reported. A thin and continuous crystalline germanium-silicon (GeSi) layer was selectively formed on n(+) doped gallium arsenide (GaAs) regions by epitaxy. A new self-aligned nickel germanosilicide (NiGeSi) Ohmic contact with good morphology was achieved using a two-step annealing process with precise conversion of the GeSi layer into NiGeSi. NiGeSi contact with the contact resistivity (rho(c)) of 1.57 Omega mm and sheet resistance (R(sh)) of 2.8 Omega/square was achieved. The NiGeSi-based self-aligned contact technology is promising for future integration in high performance III-V MOSFETs. (C) 2011 American Vacuum Society. [DOI: 10.1116/1.3592211]|
|期刊:||JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B|
|Appears in Collections:||Articles|
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