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dc.contributor.authorChen, Wen-Chihen_US
dc.contributor.authorChien, Chen-Fuen_US
dc.date.accessioned2014-12-08T15:11:29Z-
dc.date.available2014-12-08T15:11:29Z-
dc.date.issued2011-06-01en_US
dc.identifier.issn0956-5515en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s10845-009-0302-xen_US
dc.identifier.urihttp://hdl.handle.net/11536/8810-
dc.description.abstractThis paper was motivated by a request to review relative operations performance for various fabrication facilities within a leading Taiwanese semiconductor manufacturer. Performance evaluation is important but often controversial. To dispel the controversy, we propose a two-stage fabrication process model to systematically analyze metrics currently adopted, and show that the commonly used wafer-based indices are biased for operations performance. Instead, they should be decomposed into productivity, representing true operations performance, and manufacturability. We suggest the use of data envelopment analysis because of its confirmed linkages to other widely used productivity measures and its overall performance via relative comparisons. The case study illustrates how the two-stage model evaluates and analyzes real-world operations, and the empirical results show the drawbacks of conventional methods.en_US
dc.language.isoen_USen_US
dc.subjectPerformance evaluationen_US
dc.subjectFab operationsen_US
dc.subjectSemiconductor manufacturingen_US
dc.subjectDEAen_US
dc.titleMeasuring relative performance of wafer fabrication operations: a case studyen_US
dc.typeArticleen_US
dc.identifier.doi10.1007/s10845-009-0302-xen_US
dc.identifier.journalJOURNAL OF INTELLIGENT MANUFACTURINGen_US
dc.citation.volume22en_US
dc.citation.issue3en_US
dc.citation.spage447en_US
dc.citation.epage457en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000290574400011-
dc.citation.woscount7-
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