標題: 智慧型代理人軟體之應用與建構一微影疊對製程指派問題
Smart Agent Software —Dispatch of Lithography Overlay Process
作者: 謝文堯
林君信
管理學院管理科學學程
關鍵字: 智慧型代理人;微影疊對;指派;Smart Agent;Lithography Overlay;Dispatch
公開日期: 2006
摘要: 黃光微影製程是IC生產中最關鍵的一門技術,它決定了整個製程的先進程度。在現行的半導體黃光製程中,由於各機台間的差異,因此在Critical Layer常會看到有卡單機或卡Group的限制,以避免機台間的Offset導致曝光出來的圖像有Overlay偏移。 為了減少Layer間的偏移,尤其較Critical的Layer,會限制在同一台機台上加工(Single Tool Constrain),以增加製程的穩定度。這種限制使得已是Bottleneck的黃光區微影機台,在生產作業的規劃上顯得更困難與複雜。 在生管領域及許多IEEE的Paper中,發展了許多的派工法則來滿足此種限制,諸如:同族(Family-based)派工法則、避免飢餓法(Starvation Avoidance, Glassey and Petrakian, SA)、FIFO、EDD、SRPT…etc.但目前的方式都是被動地被單機限制下(Single Tool Constrain)所發展出來的解法,並無法真正解決問題。 本研究藉整合多個製程與製造控制系統,使用多變數權重演算法主動地將單機限制問題解決,並運用智慧型代理人方式撰寫軟體,實際建構模式與系統,真正地幫助半導體公司解決所遇到的製程與派工問題。
Lithography is the most key one technology in the IC production, it determine the advanced degree in the whole process. In the current lithography process, because of the difference among each tool, so we can usually see that Critical Layer has the restrictions of Single Tool or Grouping to avoid Offset between tools that result in overlay or energy shift. In order to reduce the skew among Layer, especially relatively Layer of Critical, knows the restriction to process on the same tool (Single Tool Constrain), in order to increase process’s stability degree. The restriction makes lithography machines of Bottleneck already, seem more difficult and more complicated on planning of production operation. In Production planning field and Papers of IEEE, many of dispatching rules were developed to satisfy this kind of restriction. Such as: Family-based, Starvation Avoidance (Glassey and Petrakian, SA) , FIFO, EDD, SRPT…etc. But present ways are all developed with the constrains of (Single Tool Constrain), and unable to really solve the problem. The Paper combined several process and manufacturing control system, using multi-variables weighting algorithm to solve single-tool-restrain problem voluntarily. And then using intelligent agent method to develop the software, building and constructing model and system actually, solving process and dispatch problem semiconductor’s company met actually.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT009462505
http://hdl.handle.net/11536/82333
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