標題: Electromigration in Sn-Cu intermetallic compounds
作者: Wei, C. C.
Chen, C. F.
Liu, P. C.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: copper alloys;electromigration;metallisation;solders;tin alloys
公開日期: 15-Jan-2009
摘要: As the shrinking in bump size continues, the effect of intermetallic compounds (IMCs) on electromigration becomes more pronounced. Electromigration in Sn-Cu intermetallic compounds was examined using edge displacement method. It was found that Cu(6)Sn(5) compounds are more susceptible to electromigration than Cu(3)Sn compounds. The lower solidus temperature and higher resistivity of the Cu(6)Sn(5) IMCs are responsible for its higher electromigration rate. Length-dependent electromigration behavior was found in the stripes of various lengths and the critical length was determined to be between 5 and 10 mu m at 225 degrees C, which corresponded to a critical product between 2.5 and 5 A/cm. Furthermore, the Sn-Cu compounds were proven to have better electromigration resistance than eutectic SnAgCu solder.
URI: http://dx.doi.org/10.1063/1.3072662
http://hdl.handle.net/11536/7746
ISSN: 0021-8979
DOI: 10.1063/1.3072662
期刊: JOURNAL OF APPLIED PHYSICS
Volume: 105
Issue: 2
結束頁: 
Appears in Collections:Articles


Files in This Item:

  1. 000262970900061.pdf