標題: Thermomigration in Pb-free SnAg solder joint under alternating current stressing
作者: Hsiao, Hsiang-Yao
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: electronics packaging;focused ion beam technology;self-diffusion;silver alloys;solders;thermal diffusion;tin alloys
公開日期: 2-Mar-2009
摘要: Lead-free solders have been adopted by the microelectronics industry. However, their thermomigration behaviors are unclear. Thermomigration in eutectic SnAg3.5 solder joints was investigated using an alternating current (ac) of 0.57 A at 100 degrees C. The ac eliminates the electromigration effect and creates a thermal gradient of 2829 degrees C/cm, facilitating the study of thermomigration. Arrays of tiny markers fabricated by a focused ion beam are employed to measure the thermomigration rate. It is found that Sn atoms migrated toward the hot end. The thermomigration flux and molar heat of transport are measured to be 5.0x10(12) atoms/cm(2) and 1.36 kJ/mole, respectively.
URI: http://dx.doi.org/10.1063/1.3089872
http://hdl.handle.net/11536/7507
ISSN: 0003-6951
DOI: 10.1063/1.3089872
期刊: APPLIED PHYSICS LETTERS
Volume: 94
Issue: 9
結束頁: 
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