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dc.contributor.authorLin, K. S.en_US
dc.contributor.authorHuang, H. Y.en_US
dc.contributor.authorChou, C. P.en_US
dc.date.accessioned2014-12-08T15:09:47Z-
dc.date.available2014-12-08T15:09:47Z-
dc.date.issued2009-03-05en_US
dc.identifier.issn0925-8388en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.jallcom.2008.03.112en_US
dc.identifier.urihttp://hdl.handle.net/11536/7498-
dc.description.abstractIn order to clarify the effect of the addition of Co to SAC105 solder, the reaction between solder and Au/Ni surface finish has been investigated, and the joint strength was also evaluated by a ball shear test. After soldering, the interfacial reaction layer in the SAC105 Co solder contained Co, and the chemical composition of intermetallic compounds (IMCs) were identified as (Cu,Ni,Co)(6)Sn(5) and (Ni,Cu,Co)(3)Sn(4) by energy-dispersive X-ray spectrometer (EDX), which significantly differed from that of SAC105 solder. After multiple reflows, the formation rate of the (Cu,Ni,Co)(6)Sn(5) IMC for the Co-added solder slow compared with that of (Cu,Ni)(6)Sn(5) IMC for SAC105 solder. Experimental results clearly indicate that adding small amounts (0.05 wt.%) of Co to SAC105 solder strongly affected the formation of the IMC at the interface. Furthermore, ball shear test results demonstrate that the SAC105 and SAC105 Co solder joints have good joint reliability. (C) 2008 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectLead-free solderen_US
dc.subjectCo additionen_US
dc.subjectInterfacial reactionen_US
dc.subjectJoint strengthen_US
dc.subjectBall shear testen_US
dc.titleInterfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reactionen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.jallcom.2008.03.112en_US
dc.identifier.journalJOURNAL OF ALLOYS AND COMPOUNDSen_US
dc.citation.volume471en_US
dc.citation.issue1-2en_US
dc.citation.spage291en_US
dc.citation.epage295en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000265086300070-
dc.citation.woscount9-
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