標題: 晶圓廠投線的時排程研究
Wafer Hourly Release Scheduling Methods for Semiconductor Fabrication
作者: 石孟平
Shih, Meng-Ping
巫木誠
Wu, Muh-Cherng
管理學院工業工程與管理學程
關鍵字: 排程;半導體製造;接單式生產;每小時投料法則;晶圓代工;make to order;wafer hourly release schedule;wafer foundry
公開日期: 2013
摘要: 在半導體晶圓製造廠中,最初端的矽晶圓投料排程是非常重要的決策課題,特別是在接單式生產的產業,因為所有的實體製造投線作業,皆需要根據客戶的訂單,接著才能進行後續的製造流程。過去文獻研究,大多著重在相對長時間的投線規劃,如討論一週內每日投線的作業維度。然而,為了達成更精確及有效的控管,本研究針對單日內每小時維度的投線決策作探討,使用多種單日情境進行模擬,並利用數據分析手法,提出適合產品特性與其組合的四種投料方式。實驗結果顯示,本研究新發展之適用於不同情境的『批次機台法』與『平均投線法』,優於另外現行典型之兩種『依序投料法』及『指定投線量法』。
Job scheduling in the wafer start area is a very important decision in semiconductor fabrication factories, in particular in a make-to-order scenario. All wafer starts need to be triggered by customized manufacturing orders. Many prior studies have investigated the job releasing decision on a relative longer time-bucket, for example, the daily job scheduling decision in a week. To get a more precise control, this study focuses on job hourly scheduling decision within one day. Four scheduling methods are proposed and justified by discrete-event simulation. Experiment results revel that the Batch Tool Method and the Average Dispatching Method outperformed the other two methods, which are typically used in industry.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT070063322
http://hdl.handle.net/11536/73597
顯示於類別:畢業論文