標題: Hybrid-mode computation of propagation and attenuation characteristics of parallel coupled microstrips with finite metallization thickness
作者: Kuo, JT
Itoh, T
電信工程研究所
Institute of Communications Engineering
關鍵字: attenuation;metallization;microstrip;spectral domain analysis
公開日期: 1-二月-1997
摘要: The hybrid-mode mixed spectral domain approach (MSDA) is formulated to investigate the dispersion nature of multiple coupled microstrip lines with arbitrary metallization thickness, Incorporated into the solution procedure, a new set of basis functions with delta(-1/3) field singularity near conductor edges is found to be effective in calculating both the phase and attenuation constants, The computation of conductor loss is based on the perturbation procedure, Over a broad band of frequency spectrum, excellent agreement is obtained between the calculated results and existing experiment data for the metallic losses of a single microstrip and effective dielectric constants of coupled lines, The influence of finite metallization thickness on the frequency dependent modal propagation and attenuation characteristics is presented for both a three-line and four-line structure.
URI: http://dx.doi.org/10.1109/22.557610
http://hdl.handle.net/11536/735
ISSN: 0018-9480
DOI: 10.1109/22.557610
期刊: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume: 45
Issue: 2
起始頁: 274
結束頁: 280
顯示於類別:期刊論文


文件中的檔案:

  1. A1997WM23200015.pdf