The Development of a Micro Flip-flop element
Chao Chin Lai
Jin Hua Chin
Over the past few years the field of MEMS (Micro Electro Mechanical System) has become well established technology. This development was advanced by the prospect of being able to produce new types of sensors and fabricate them at low cost. We use some semiconductor technology and (110) p-type Silicon wafer to minimize some fluid element. Use the characteristic of the wafer's crystal face and choose suitable etching solution (KOH) to etch the wafer, we can get the channel which is vertical to the wafer's surface. And the channel part is finished. Then, use the same etching solution to etch through wafer, we can get holes on the wafer. And the port part (input/output part) is finished. Using the bond technology to assemble wafers (channel part and port part). Then, we can get a micro fluidic logic element. In the experiment, the element (port part) link up capillaries together and connect with the suitable fluidic pressure supply. Configures these fluidic pressure supplies and signal controller and observes the logic characteristics of the micro fluidic logic element. The results of the experiment conform to the logic characteristics of the micro fluidic logic element. And the pressure of the output is about 2 bar.
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