Study on Arc Ion Plating coated DLC using the different Ti binding layer
|Keywords:||電弧離子鍍膜法;類鑽薄膜;鈦;附著力;中間層;內應力;非晶質;粗糙度;Arc Ion Plating;DLC;Ti;adhesion;binding layer;intrinsic stress;amorphous;roughness|
In order to obtain the desired properties, the deposited diamond-like thin film was performed by arc ion plating process. The films deposited by arc ion plating can possess superior properties as diamond does. However, with increasing sp3 structure in diamond-like thin film, the intrinsic stress can be increased. This phenomenon will lead to the decrease of the adhesion between thin film and substrate. In order to enhance the adhesion property, the binding layer between diamond-like film and substrate is bound to be performed. Based on the above description, the interlayer plays an important role in this study. The Ti layer possesses the capability of adjustment with lattice constant and thermal expansion coefficient between diamond-like film and substrate. By deposition of Ti film, the intrinsic stress will be decreased. The purpose of this study was to evaluate the performance with various thickness of binding layer and various gas in the deposition. The structure variation and its influence to the mechanical properties such as film stress and adhesion was also investigated. From the results of experiments, the high contents of sp3 in diamond-like film can be synthesized by arc ion plating. The diamond-like film with nitrogen is apt to formation of sp2 bonds and results in the decrease of sp3 concentration in diamond-like film. For amorphous diamond-like film and amorphous diamond-like film with hydrogen, with the increase of the thickness of Ti binding layer, the intrinsic stress of film decreases. However, the surface roughness of deposited Ti binding layer is dependent on the impurity in arc ion plating process. The impurity particles in plating process can increase surface roughness. The hardness of diamond-like film increases with the contents of sp3. Because the greater difference of hardness between diamond-like film and Ti binding layer, the whole film hardness can decreased.
|Appears in Collections:||Thesis|