Fatigue Life Analysis for Solder Joints of Flip Chip Package
|Keywords:||覆晶構裝;潛變;疲勞失效;有限元素法;田口法;Flip Chip Package;Creep;Fatigue Failure;Finite Element Method;Taguchi Method|
Flip chip package has become a very attractive solution with increasing demand on low cost, miniaturization, and weight reduction of electronic products. The major reliability issue of flip chip package is solder joint crack due to thermal expansion mismatch between joined materials. The purpose of this research is to study the solder joint reliability of flip chip subjected to temperature cycling. FEM code ABAQUS was applied to investigate the nonlinear behavior of eutectic solder joint (63Sn-37Pb) under temperature load. Fatigue life of solder joint was predicted by Coffin-Manson relationship. Good agreements were obtained between numerical results in this thesis and experimental data in other researches. To complete the study, Taguchi method was performed on the choices of underfill materials and size of the package. The final goal is to establish the methodology in obtaining the optimized combination of these parameters to improve the reliability of flip chip.
|Appears in Collections:||Thesis|