標題: Effects of silver oxalate additions on the physical characteristics of low-temperature-curing MOD silver paste for thick-film applications
作者: Lin, Hong-Ching
Lin, Pang
Lu, Chun-An
Wang, Sea-Fue
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Silver paste;Metallo-organic-decomposition;Silver oxalate
公開日期: 1-Nov-2009
摘要: In this paper, the effect of silver oxalate addition on physical characteristics of metallo-organic-decomposition (MOD) silver screen-printable paste for thick film technology was investigated. The addition of silver oxalate in the paste not only produces fresh fine silver particles after curing, but also reduces the decomposition temperature of the lubricant coated on the silver flakes. This is an effective route to provide fine silver particles to the paste without significantly changing the theological behavior. At the curing temperature of 225 degrees C, the resistivity decreases from 180.1 to 31.9 mu Omega-cm, as the silver oxalate content increases from 0 to 10 wt%. This is due to the fact that active silver catalysts produced increase the packing density of silver flakes, and also the removal of lubricant from the surface of silver flakes enhances the electrical conductivity, thereby decreasing the resistance of film. (C) 2009 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.mee.2009.04.010
http://hdl.handle.net/11536/6514
ISSN: 0167-9317
DOI: 10.1016/j.mee.2009.04.010
期刊: MICROELECTRONIC ENGINEERING
Volume: 86
Issue: 11
起始頁: 2316
結束頁: 2319
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