標題: Evaluation of Cu-bumps with lead-free solders for flip-chip package applications
作者: Lin, Kung-Liang
Chang, Edward-Yi
Shih, Lin-Chi
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Copper bump;Lead-free;Electroplating
公開日期: 1-十二月-2009
摘要: Low cost electroplated Cu-bump with environmental friendly Sn solder was developed for flip-chip applications. The seed layer used was Ti/WN(x)/Ti/Cu where WN(x) was used as the Cu diffusion barrier and Ti was used to enhance the adhesion between bump and the chip pad. Thick negative photoresist (THB JSR-151N) with a high aspect ratio of 2.4 was used for electroplating of copper bump and Sn solder. The Sn solder cap was reflowed at 225 degrees for 6 min at N(2) atmosphere. No wetting phenomenon was observed for the Sn solder as evaluated by energy-dispersed spectroscopy (EDS). The Cu-bump with Ti/WN(x)/Ti/Cu seed layer not only have higher shear force than the Cu-bump with Ti/Cu seed layer but also has higher resistance to fatigue failure than the Au, SnCu, SnAg bumps. (C) 2009 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.mee.2009.04.027
http://hdl.handle.net/11536/6376
ISSN: 0167-9317
DOI: 10.1016/j.mee.2009.04.027
期刊: MICROELECTRONIC ENGINEERING
Volume: 86
Issue: 12
起始頁: 2392
結束頁: 2395
顯示於類別:期刊論文


文件中的檔案:

  1. 000271846900005.pdf