Novel Trifunctional Silicon-containing Epoxide Monomer for Flame Retardants
A new silicon-containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon-containing epoxy resins are synthesized and characterized. The activation energies of TGPSO curing reaction with various curing agents, including 4,4-diaminodiphenylmethane (DDM), 4,4-diaminodiphenylsulfone (DDS) and dicyanodiaminde (DICY) are found to be 180, 196.5 and 154kj/mol. The curing reation of TGPSO with diamines are determined to be first order reaction through means of Arrhenius plots. The introduction of silicon-containing oxirane compared with Epon 828, Eponex 1015, and DER 732 showed relatively high char yield as well as higher limiting oxygen index (LOI = 35) than the commercial epoxy resins, confirming the usefulness of these silicon-containing epoxy resins as flame retardant. Chat yields and LOI measurements demonstrate that incorporating silicon into epoxy resins is able to improve their flame retardancy. Thermal degradation mechanism of TGPSO was studied by pyrolysis gas chromatograpy/Mass spectrometry (PGC/MS) and thermogravimetric analysis gas chromatograpy/Mass spectrometry. The most major pyrolysates of TGPSO are found to be benzene, toluene and CO2 by the PG/MS.
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