標題: Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
作者: Liang, S. W.
Hsiao, Hsiang-Yao
Chen, Chih
Xu, Luhua
Tu, K. N.
Lai, Yi-Shao
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Electromigration;Pb-free solder
公開日期: 1-十二月-2009
摘要: A quantitative analysis of the nonuniform distribution of current density and nonuniform rate of electromigration has been carried out by measuring the movement of an array of diffusion markers. Tiny marker arrays were fabricated by focused ion beam on the polished surface of flip-chip solder joints near the anode to measure the electromigration rate. The marker velocity at the current-crowding region was found to be at least five times larger than at locations far from the region. Some of the markers in the low-current-density region possess negative velocities, indicating that backflow occurs during the electromigration. The backflow, in which the atomic flow is against the electron flow, is explained by a constant-volume model as well as the back-stress induced by electromigration.
URI: http://dx.doi.org/10.1007/s11664-009-0913-1
http://hdl.handle.net/11536/6350
ISSN: 0361-5235
DOI: 10.1007/s11664-009-0913-1
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 38
Issue: 12
起始頁: 2443
結束頁: 2448
顯示於類別:期刊論文


文件中的檔案:

  1. 000272301900004.pdf