標題: Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
作者: Chen, Chih
Tong, H. M.
Tu, K. N.
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: microelectronic packaging;diffusion;reliability;current stressing;Joule heating;thermal gradient;underbump metallization
公開日期: 2010
摘要: Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging industry due to environmental concerns. Both electromigration (EM) and thermomigration (TM) have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. We review the unique features of EM and TM in flip-chip solder bumps, emphasizing the effects of current crowding and joule heating. In addition, the challenges to a better understanding of EM and TM in Pb-free solders are discussed. For example, the anisotropic nature of Sn microstructure in Pb-free solders can enhance the dissolution rates of Ni and Cu in solders driven by EM and TM.
URI: http://hdl.handle.net/11536/6094
http://dx.doi.org/10.1146/annurev.matsci.38.060407.130253
ISBN: 978-0-8243-1740-9
ISSN: 1531-7331
DOI: 10.1146/annurev.matsci.38.060407.130253
期刊: ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 40
Volume: 40
起始頁: 531
結束頁: 555
顯示於類別:期刊論文


文件中的檔案:

  1. 000280818700021.pdf