標題: On Reducing Test Power, Volume and Routing Cost by Chain Reordering and Test Compression Techniques
作者: Lin, Chia-Yi
Hsu, Li-Chung
Chen, Hung-Ming
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: DFT;TSP;test power
公開日期: 1-Mar-2010
摘要: With the advancement of VLSI manufacturing technology entire electronic systems can be Implemented in a single intergrated circuit Due to the complexity in SoC design. circuit testability becomes one of the most challenging works Without careful planning it Design For Testability (DFT) design, circuits consume mote power in test mode operation than that in normal functional mode This elevated testing power may cause problems including overall yield lost and instant circuit damage In this paper, we present two approaches to minimize scan based DFT power dissipation First methodology Includes routine cost consideration in scan chain reordering after cell placement. while second methodology provides test pattern compression for lower power We formulate the first problem as a Traveling Salesman Problem (TSP). with different cost evaluation from [18],[19] and apply an efficient heuristic to solve it lit the second problem we provide a selective scan chain architecture and perform a simple yet effective encoding scheme for lower scan testing power dissipation The experimental results of ISCAS'89 benchmarks show that the first methodology obtains up to 10% average power saving under the same low routing cost compared with a recent result in [19] The second methodology reduces over 17% of test power compared with filling all don't care (X) bit with 0 in one of ISCAS'89 benchmarks We also provide the integration flow of these two approaches in this paper
URI: http://dx.doi.org/10.1587/transele.E93.C.369
http://hdl.handle.net/11536/5797
ISSN: 0916-8524
DOI: 10.1587/transele.E93.C.369
期刊: IEICE TRANSACTIONS ON ELECTRONICS
Volume: E93C
Issue: 3
起始頁: 369
結束頁: 378
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