標題: The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application
作者: Yang, Chia-Yeh
Cheng, Yu-Ting
Hsu, Wen-Syang
機械工程學系
電子工程學系及電子研究所
Department of Mechanical Engineering
Department of Electronics Engineering and Institute of Electronics
關鍵字: Hermetic encapsulation;nano-electromechanical systems (NEMS) manufacture;nano-roughening;scaling rule;ultraviolet (UV) adhesive bonding
公開日期: 1-五月-2010
摘要: The paper shows the importance of nano-roughening on the bonding interface to the reliability enhancement of adhesive bond for ensuring the continuation of packaging shrinkage from MEMS to NEMS. The roughening is realized via a nonuniformly etching characteristic of PR which is etched and then utilized as an etching mask for following silicon etching process. Ultraviolet adhesive for silicon-to-glass bonding is utilized for the verification of the nano-roughening effect on NEMS hermetic encapsulation. The average roughnesses of the silicon substrate before and after roughening are 0.4 nm and 12.4 nm, respectively. Experimental results show that the roughness increase of silicon substrate can effectively provide more than 30% bonding strength enhancement and 30% leakage reduction. In addition, stamp-and-stick test shows that nano-roughening indeed provides a better adhesive characteristic that can further ensure the success of the stamp-and-stick process for nano/microfabrication.
URI: http://dx.doi.org/10.1109/TADVP.2009.2038235
http://hdl.handle.net/11536/5497
ISSN: 1521-3323
DOI: 10.1109/TADVP.2009.2038235
期刊: IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume: 33
Issue: 2
起始頁: 356
結束頁: 361
顯示於類別:期刊論文


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  1. 000277343200007.pdf