標題: Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
作者: Liang, S. W.
Chen, Chih
Han, J. K.
Xu, Luhua
Tu, K. N.
Lai, Yi-Shao
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 1-五月-2010
摘要: Mass extrusion occurs in electromigration at the anode in cross-sectioned Sn-0.7Cu flip-chip solder joints. In a pair of joints, the hillock squeezed out at the anode on the board side is more serious than the whisker grown at the anode on the chip side. The difference of mass extrusion has been found to be affected by the amount of intermetallic compound (IMC) formation in the solder bump. It is found that when a large amount of Cu-Sn IMCs form in the grain boundaries of Sn grains, small hillocks are extruded on the anode end. It is proposed that the excessive IMC formation may be able to block the diffusion path of Sn atoms, so the growth of both the Sn whiskers and hillocks are retarded. (C) 2010 American Institute of Physics. [doi:10.1063/1.3410796]
URI: http://dx.doi.org/10.1063/1.3410796
http://hdl.handle.net/11536/5481
ISSN: 0021-8979
DOI: 10.1063/1.3410796
期刊: JOURNAL OF APPLIED PHYSICS
Volume: 107
Issue: 9
結束頁: 
顯示於類別:期刊論文


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  1. 000277834300480.pdf