Title: Study of electromigration of flip-chip solder joints using Kelvin probes
Authors: Chang, Y. W.
Chen, Chih
Department of Materials Science and Engineering
Keywords: electromigration in solder joints;Kelvin structure
Issue Date: 2007
Abstract: Kelvin bump probes were fabricated in flip-chip solder joints, and they were employed to monitor the void formation during electromigration. We found that voids started to form at approximately 5% of the failure time under 0.8 A at 150 degrees C, and the bump resistance increased only 0.02 m Omega in the initial stage of void formation. Three-dimensional simulation was performed to examine the increase in bump resistance at different stages of void formation, and it fitted the experimental results quite well. This technique provides a systematic way for investigating the void formation during electromigration.
URI: http://hdl.handle.net/11536/5357
ISBN: 978-0-7354-0459-5
ISSN: 0094-243X
Volume: 945
Begin Page: 194
End Page: 201
Appears in Collections:Conferences Paper