|標題:||Effects of current crowding and Joule heating on reliability of solder joints|
|作者:||Liang, S. W.|
Chiu, S. H.
Department of Materials Science and Engineering
|關鍵字:||electromigration;flip-chip solder joints;Joule heating|
|摘要:||This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.|
|期刊:||STRESS-INDUCED PHENOMENA IN METALLIZATION|
|Appears in Collections:||Conferences Paper|