Title: Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes
Authors: Chen, K. N.
Zhu, Y.
Wu, W. W.
Reif, R.
材料科學與工程學系
電子工程學系及電子研究所
Department of Materials Science and Engineering
Department of Electronics Engineering and Institute of Electronics
Keywords: Wafer bow;wafer bonding;3D integration
Issue Date: 1-Dec-2010
Abstract: This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications.
URI: http://dx.doi.org/10.1007/s11664-010-1341-y
http://hdl.handle.net/11536/5234
ISSN: 0361-5235
DOI: 10.1007/s11664-010-1341-y
Journal: JOURNAL OF ELECTRONIC MATERIALS
Volume: 39
Issue: 12
Begin Page: 2605
End Page: 2610
Appears in Collections:Conferences Paper


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