Title: Easy Process and Performance Improvement for Top-Emission Organic Light-Emitting Diodes by Using UV Glue as the Insulation Layer on Copper Substrate
Authors: Tsai, Yu-Sheng
Wang, Shun-Hsi
Juang, Fuh-Shyang
Chang, Shu-Wei
Chen, Chuan-hung
Chung, Ming-Hua
Hsieh, Tsung-Eong
Liu, Mark-O.
Liao, Teh-Chao
Department of Materials Science and Engineering
Keywords: Heat dissipation;junction temperature;lifetime;luminance efficiency;organic light-emitting diode (OLED);UV glue
Issue Date: 1-Jul-2010
Abstract: A high heat dissipation material (copper, Cu) was employed as the substrate for top emission organic light-emitting diodes (TEOLEDs). The UV glue was spin-coated onto the Cu substrate as the insulation layer to effectively improve Cu surface roughness and reduce process complexity. From the optoelectronic results, the optimized device with the Cu substrate shows the maximum luminance of 14110 cd/m(2) and luminance efficiency of 7.14 cd/A. The surface and junction temperatures are measured to discuss the heat-dissipating effect on device performance. From the results, TEOLED fabricated on a Cu substrate has lower junction (55.34 degrees C) and surface (25.7 degrees C) temperatures, with the lifetime extended seven times. We employed Cu foil as the substrate for flexible TEOLED with maximum luminance of 10310 cd/m(2) and luminance efficiency of 7.3 cd/A obtained.
URI: http://dx.doi.org/10.1109/JDT.2010.2048300
ISSN: 1551-319X
DOI: 10.1109/JDT.2010.2048300
Volume: 6
Issue: 7
Begin Page: 279
End Page: 283
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