標題: SAC305合金及SAC105合金與ENEPIG表面處理之接合研究
Investigation of SAC305 and SAC105 soldering with ENEPIG
作者: 葉雅靜
Yeh, Ya-Ching
周長彬
Chou, Chang-Pin
工學院精密與自動化工程學程
關鍵字: 化鎳鈀金;推球試驗;高速推球測試;ENEPIG;Ball shear test;High speed ball shear test
公開日期: 2011
摘要: 本文主要在探討成分為Sn-1.0Ag-0.5Cu與Sn-3.0Ag-0.5Cu的BGA錫球銲接在化鎳鈀金(ENEPIG)表面處理後的銲接反應與其機械強度。 本文中將不同合金的樣品經高溫儲存測試後,分別進行推球測試(0.0001m/s)與高速推球測試(1m/s),以探討不同合金與機械強度的關係。實驗結果顯示雖然Sn-1.0Ag-0.5Cu合金在不同速度的剪切強度試驗,強度值皆低於Sn-3.0Ag-0.5Cu合金,但在高速推球測試中的破壞抵抗能力卻較為優秀。 關鍵字: 化鎳鈀金、推球試驗、高速推球測試。
This study concentrates on the soldering reactions and the mechanical response between Sn-1.0Ag-0.5 and Sn-3.0Ag-0.5Cu lead-free solders and ENEPIG surface finish. In order to investigate mechanical property of this two different alloy, the samples are firstly stored in high temperature condition then tested with two difference shear rate, i.e., ball shear test(0.0001 m/s) and high speed ball shear test(1 m/s). The results indicated that both shear strength in difference shear rate of Sn-1.0Ag-0.5Cu joints lower than Sn-3.0Ag-0.5Cu, however, the fracture resistance ability is better at high speed ball shear test. Keywords: ENEPIG, Ball shear test, High speed ball shear test.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT079769503
http://hdl.handle.net/11536/46325
Appears in Collections:Thesis


Files in This Item:

  1. 950301.pdf