標題: 覆晶多晶片模組構裝設備開發
Flip Chip Based MCM Packaging Equipment Development
作者: 張志成
Cheng, Jhang-Jhih
成維華
Chieng, Wei-Hua
機械工程學系
關鍵字: 覆晶機台;WINPC32;RTX;Flip chip machine;WINPC32;RTX
公開日期: 2009
摘要: 覆晶技術越來越廣泛使用在晶片接合的製程上面,製程的好壞更是取決於其機構的設計。本論文提出了以自我對準機構,力量控制機構,微步進機機構去取代原有的覆晶機台的氣壓鋼及導螺桿,以改善其力量控制及平面定位的部份,並利用WINPC32及RTX即時作業系統去整合覆晶機台,使得晶片不會因為過大的壓力而壞掉,提高其製程的良率。
Flip chip technology widely used in bonding process, and the bonding process which is good or not depends on its mechanism design. This paper uses the self-aligned mechanism, the force control mechanism, micro-stepping mechanism to replace the pneumatic cylinder and lead screw on the existing flip chip machine. And use WINPC32 and the RTX real-time operating system to integrate the flip chip machine. Then the chip will not be pressured too much and broken, improve the process yield rate.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT079714609
http://hdl.handle.net/11536/44764
Appears in Collections:Thesis


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