標題: INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES
作者: CHIOU, BS
LIU, KC
DUH, JG
PALANISAMY, PS
電控工程研究所
Institute of Electrical and Control Engineering
公開日期: 1-六月-1990
URI: http://dx.doi.org/10.1109/33.56156
http://hdl.handle.net/11536/4098
ISSN: 0148-6411
DOI: 10.1109/33.56156
期刊: IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY
Volume: 13
Issue: 2
起始頁: 267
結束頁: 274
顯示於類別:期刊論文


文件中的檔案:

  1. A1990DG96600004.pdf