標題: Direct evidence of Au segregation in laser welded Au-coated Invar material
作者: Wang, SC
Chi, S
Hsieh, KC
Yang, YD
Cheng, WH
光電工程學系
Department of Photonics
關鍵字: Au coating;Invar material;laser welding;optoelectronic packaging
公開日期: 1-八月-1997
摘要: Evidence of the Au segregation within the crack region in laser welded Au-coated Invar material for semiconductor laser packaging is investigated. Results obtained from the metallography, scanning electron microscope (SEM) mapping, energy dispersive spectrometer (EDS) Line profile,and Auger electron spectroscopy find that the cracks in the welded joints occur around the Au rich boundaries. The SEM Au mapping and EDS line profiles show that Au accumulates at the crack region. This direct observation indicates that one of the primary causes of cracks in laser welded Au-coated materials is due to the segregation of Au in the final stage of solidification. Detailed knowledge of the defect formation mechanisms in laser welded Au-coated materials is important for the practical design and fabrication of reliable optoelectronic packaging.
URI: http://dx.doi.org/10.1007/s11664-997-0284-4
http://hdl.handle.net/11536/399
ISSN: 0361-5235
DOI: 10.1007/s11664-997-0284-4
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 26
Issue: 8
起始頁: L21
結束頁: L23
顯示於類別:期刊論文


文件中的檔案:

  1. A1997XT94600016.pdf