Design and implementation of flip-chip mechanism
|關鍵字:||覆晶;力量控制;Z軸定位;電磁力;flip chip;force control;Z-axis positioning;magnetic force|
The Packaging industry continuously towards the plenty of I / O pins, size decreased, systems integration, faster, and cost down tendency. In view of Taiwan's current rate is not high self-made equipment, and critical Parts also held in the United States, Japan, and European manufacturers. The equipments and materials cost that account for more than 60 percent of the overall cost, and also make the packaging equipment costs relative increase. The main purpose of this thesis is to design the vertical positioning system and bonding force control of flip chip devices. Now, the vertical positioning system and bonding force control largely driven by pneumatic cylinder. But force control has the stick-slip effect makes bonding force difficult to control. Therefore, this thesis proposes to use two-stage control for vertical positioning and force control. The servomotor is for the Z-axis vertical positioning. And use the magnetic force and spring force to control the bonding force. The load cell and the encoder of servomotor are taken as the sensors of feedback signals in this system.
|Appears in Collections:||Thesis|
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