Title: Stability of nanoscale twins in copper under electric current stressing
Authors: Chen, Kuan-Chia
Wu, Wen-Wei
Liao, Chien-Neng
Chen, Lih-Juann
Tu, K. N.
Department of Materials Science and Engineering
Issue Date: 15-Sep-2010
Abstract: Migration of {112} incoherent twin boundary (ITB) in nanotwinned Cu under electric current stressing has been observed using in situ high-resolution transmission electron microscopy. The current-driven ITB migration is found to be four orders of magnitude faster than that driven thermally. We propose that electric current plays a role of shuffling Cu atoms at ITB/coherent twin boundary junctions, which enhances nucleation of {112} steps and facilitates twin boundary migration in Cu. By understanding how twin boundaries respond to electric current force we shall be able to trace the property change in nanotwinned Cu under electric current stressing, which would be an essential assessment of interconnect reliability. (C) 2010 American Institute of Physics. [doi: 10.1063/1.3483949]
URI: http://dx.doi.org/10.1063/1.3483949
ISSN: 0021-8979
DOI: 10.1063/1.3483949
Volume: 108
Issue: 6
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