標題: Analysis of a partially sealed package for microstrip-line circuits
作者: Chen, HH
Chung, SJ
電信工程研究所
Institute of Communications Engineering
關鍵字: metal diaphragms;packaged microstrip line;partially sealed cavity;spurious modes
公開日期: 1-Dec-1998
摘要: A partially sealed package formed by two metal diaphragms with or without an absorber is proposed and analyzed for shielded microstrip-line circuits. The mode-matching method, method of lines, and finite-element method are mixed appropriately to investigate the package. For a specific analysis, an electric current filament and a microstrip-line gap are chosen to simulate, respectively, an active circuit element (CE) and a passive CE to be packaged. The suppression effect of the package on the spurious (higher order) modes and the influence on the dominant mode are fully studied by comparing the excitation and scattering characteristics of the CE's with and without the package.
URI: http://dx.doi.org/10.1109/22.739293
http://hdl.handle.net/11536/31702
ISSN: 0018-9480
DOI: 10.1109/22.739293
期刊: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume: 46
Issue: 12
起始頁: 2124
結束頁: 2130
Appears in Collections:Articles


Files in This Item:

  1. 000078098700020.pdf