標題: Improvement in adhesion of diamond films on cemented WC substrate with Ti-Si interlayers
作者: Lin, CR
Kuo, CT
Chang, RM
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: adhesion;diamond films;microwave plasma CVD;stress
公開日期: 1-Dec-1998
摘要: Diamond films were deposited on the cemented WC+(3-5)% Co substrates by a microwave plasma chemical vapor deposition system. The substrates were pretreated with various processing steps before diamond deposition, including: polishing, etching for Co removal, Ti coating by DC sputter, and amorphous Si coating by E-gun. The residual stress of the films was determined by both Raman shift and low incident beam angle X-ray diffraction (LIBAD) methods. The adhesion of the films was evaluated by indentation adhesion testing. The him morphology and film-substrate interface structure were examined by SEM and Auger electron spectroscopy, respectively. The results show that Ti-Si can be a good interlayer to improve film adhesion and inhibit diffusion of Co to the substrate surface on diamond nucleation. This is due to the formation of strong TiC and SiC bonding to enhance film adhesion; Si acts as a promoter for diamond nucleation, and the residual stress with application of interlayer is much lower than that interlayer-free. The results also show the existence of an optimum Ti thickness for the best film adhesion. (C) 1998 Elsevier Science S.A. All rights reserved.
URI: http://hdl.handle.net/11536/31696
ISSN: 0925-9635
期刊: DIAMOND AND RELATED MATERIALS
Volume: 7
Issue: 11-12
起始頁: 1628
結束頁: 1632
Appears in Collections:Articles


Files in This Item:

  1. 000077617300006.pdf