標題: A comprehensive study of hot carrier stress-induced drain leakage current degradation in thin-oxide n-MOSFET's
作者: Wang, TH
Chiang, LP
Zous, NK
Hsu, CF
Huang, LY
Chao, TS
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: drain leakage degradation;hot carrier;thin oxide
公開日期: 1-Sep-1999
摘要: The mechanisms and characteristics of hot carrier stress-induced drain leakage current degradation in thin-oxide n-MOSFET's are investigated. Both interface trap and oxide charge effects are analyzed. Various drain leakage current components at zero V-gs such as drain-to-source subthreshold leakage, band-to-band tunneling current, and interface trap-induced leakage are taken into account, The trap-assisted drain leakage mechanisms include charge sequential tunneling current, thermionic-field emission current,:and Shockley-Read-Hall generation current. The dependence of drain leakage current on supply voltage, temperature, and oxide thickness is characterized. Our result shows that the trap-assisted leakage may become a dominant drain leakage mechanism as supply voltage is reduced. In addition, a strong oxide thickness dependence of drain leakage degradation is observed. In ultra-thin gate oxide (30 Angstrom) n-MOSFET's, drain leakage current degradation is attributed mostly to interface trap creation, while in thicker oxide (53 Angstrom) devices, the drain leakage current exhibits two-stage degradation, a power law degradation rate in the initial stage due to interface trap generation, followed by an accelerated degradation rate in the second stage caused by oxide charge creation.
URI: http://dx.doi.org/10.1109/16.784188
http://hdl.handle.net/11536/31102
ISSN: 0018-9383
DOI: 10.1109/16.784188
期刊: IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume: 46
Issue: 9
起始頁: 1877
結束頁: 1882
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