標題: Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications
作者: Hu, JC
Chang, TC
Wu, CW
Chen, LJ
Hsiung, CS
Hsieh, WY
Lur, W
Yew, TR
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Jul-2000
摘要: Effects of a new combination of additives in acid electroplating solution on the properties of Cu thin films have been investigated, The electroplated Cu films exhibit an excellent superfilling behavior. 0.18 mu m vias with an aspect ratio exceeding 5 were filled completely without any void or seam. Strong (111) texture was found for the electroplated Cu films. The resistivity of a 450-nm-thick Cu film was measured to be 1.84 mu Omega cm. (C) 2000 American Vacuum Society. [S0734-2101(00)08004-0].
URI: http://dx.doi.org/10.1116/1.582326
http://hdl.handle.net/11536/30432
ISSN: 0734-2101
DOI: 10.1116/1.582326
期刊: JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
Volume: 18
Issue: 4
起始頁: 1207
結束頁: 1210
Appears in Collections:Conferences Paper


Files in This Item:

  1. 000088276800033.pdf