標題: Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)
作者: Gau, WC
Chang, TC
Lin, YS
Hu, JC
Chen, LJ
Chang, CY
Cheng, CL
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Sep-2000
URI: http://dx.doi.org/10.1116/1.1286102
http://hdl.handle.net/11536/30314
ISSN: 0734-2101
DOI: 10.1116/1.1286102
期刊: JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
Volume: 18
Issue: 5
起始頁: 2597
結束頁: 2597
Appears in Collections:Articles


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