標題: Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints
作者: Miao, HW
Duh, JG
Chiou, BS
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Nov-2000
摘要: The eutectic SnBi solder alloy is a candidate for Pb-free replacement of the conventional eutectic SnPb solders. This study presents series of results on the binary eutectic SnBi and ternary SnBi-1 wt % Cu a solder joints. Compositional analysis and wettability of the as-fabricated solder alloys are reported. In addition, microstructure, adhesion strength, fracture surface and contact resistance of the solder joints are also evaluated. The results of the wetting balance show that the addition of 1 wt % Cu has little effect on the contact angle of the eutectic SnBi solder alloy with various metallization layers. The adhesion strength of solder joints degrades abruptly after 2000 thermal cycles. In addition, thermal cycling would result in cracking in the solder joints, which is due to the mismatch in thermal expansion coefficients. Portions of the thermal fatigue cracks nucleate at the edge of the solder fillet, and then propagate along the solder/conductor interface. Some cracks are, however, through the Al2O3 substrate. The contact resistance of the solder/Cu joint does not increase after thermal cycling since the resistivity of Cu6Sn5 is lower than that of the solder. The solder joints of 42Sn-58Bi/Cu, SnBi-1Cu/Cu, 42Sn-58Bi/PtAg, and SnBi-1Cu/PtAg assemblies maintain their integrity after 2000 thermal cycles since the increase in contact resistance is rather small (DeltaR <0.5 m Omega). (C) 2000 Kluwer Academic Publishers.
URI: http://dx.doi.org/10.1023/A:1008928729212
http://hdl.handle.net/11536/30177
ISSN: 0957-4522
DOI: 10.1023/A:1008928729212
期刊: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume: 11
Issue: 8
起始頁: 609
結束頁: 618
Appears in Collections:Articles


Files in This Item:

  1. 000166360700006.pdf