標題: Leveling effects of copper electrolytes with hybrid-mode additives
作者: Lin, KC
Shieh, JM
Chang, SC
Dai, BT
Chen, CF
Feng, MS
Li, YH
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 1-Nov-2002
摘要: 100 nm vias were completely filled with copper for interconnect applications using an electrolyte in the presence of polyethylene glycols (PEG) and a hybrid-mode additive, benzotriazole (BTA). Electrochemical analyses indicated that BTA with a higher concentration inhibited the copper deposition rate, whereas BTA with a lower concentration accelerated the copper deposition rate. This electrolyte thus generated an enhanced deposition gradient within a gap because the PEG molecules and the high concentration of BTA, adsorbed at the opening of the gap, inhibited the deposition. Meanwhile, a little BTA diffused into the inner part of the gap and thus accelerated the deposition of copper. Therefore, this two-component (PEG and BTA) additive electrolyte had the capacity of a three-additive bath (accelerators, suppressors, and levelers). (C) 2002 American Vacuum Society.
URI: http://dx.doi.org/10.1116/1.1517262
http://hdl.handle.net/11536/28434
ISSN: 1071-1023
DOI: 10.1116/1.1517262
期刊: JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
Volume: 20
Issue: 6
起始頁: 2233
結束頁: 2237
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