標題: Investigations of pulse current electrodeposition for damascene copper metals
作者: Chang, SC
Shieh, JM
Dai, BT
Feng, MS
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 1-Nov-2002
摘要: The influence of current density, duty cycle, and frequency of the applied pulse current on film qualities of electroplated copper was discussed. With various filled damascene structures, the corresponding filling power was optimized in a range of pulse current frequency. The optimized pulse current plating in conjunction with a leveler-free electrolyte resulted in a defect-free filling in approximate 100 nm damascenes and reduced the resistivity of Cu deposits. (C) 2002 American Vacuum Society.
URI: http://dx.doi.org/10.1116/1.1518974
http://hdl.handle.net/11536/28416
ISSN: 1071-1023
DOI: 10.1116/1.1518974
期刊: JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
Volume: 20
Issue: 6
起始頁: 2295
結束頁: 2298
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