標題: MORPHOLOGY AND ADHESION STRENGTH IN ELECTROLESS CU METALLIZED ALN SUBSTRATE
作者: CHANG, JH
DUH, JG
CHIOU, BS
電控工程研究所
Institute of Electrical and Control Engineering
公開日期: 1-十二月-1993
摘要: The metallization of aluminum nitride substrates by electroless copper plating is investigated. The AIN substrate is etched by 4% NaOH to study the correlation between the adhesion strength and the surface roughness of etched AIN substrate. Both the as-received nonpolished and then polished AIN are employed herein. For the nonpolished substrate, the adhesion strength increases from 130 kg/cm2 for the sample with an average surface roughness of 0.2 mum to 230 kgf/cm2 for the one with an average surface roughness of 0.82 mum. For the polished substrate, the adhesion strength reaches 271 kg/cm2 with a surface roughness of 0.19 mum. Mechanical interlocking is the major cause for the adhesion strength between the Cu and AIN substrates. The polished substrate followed by etching could form fine cavities on the AIN surface, and the microetching effect results in a stronger mechanical interlocking, which increase the adhesion strength.
URI: http://dx.doi.org/10.1109/33.273704
http://hdl.handle.net/11536/2771
ISSN: 0148-6411
DOI: 10.1109/33.273704
期刊: IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY
Volume: 16
Issue: 8
起始頁: 1012
結束頁: 1020
顯示於類別:期刊論文


文件中的檔案:

  1. A1993NC12600035.pdf