標題: Analysis and prevention on NC-ball induced ESD damages in a 683-pin BGA packaged chipset IC
作者: Lo, WY
Ker, MD
電機學院
College of Electrical and Computer Engineering
公開日期: 1-Sep-2003
摘要: An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed. (C) 2003 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/S0026-2714(03)00278-6
http://hdl.handle.net/11536/27601
ISSN: 0026-2714
DOI: 10.1016/S0026-2714(03)00278-6
期刊: MICROELECTRONICS RELIABILITY
Volume: 43
Issue: 9-11
起始頁: 1583
結束頁: 1588
Appears in Collections:Conferences Paper


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