標題: Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
作者: Shao, TL
Lin, KC
Chen, C
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: electromigration;lead-free solder;Sn95/Sb5;flip chip;failure;intermetallic compound
公開日期: 1-Nov-2003
摘要: The electromigration-induced failure of Sn95/Sb5 flip chip solder bumps was investigated. The failure of the joints was found at the cathode/chip side after current stressing with a density of 1 X 10(4) A/cm(2) at 150degreesC for 13 sec. The growth of intermetallic compounds (IMCs) was observed at the anode side after current stressing. Voids were found near the current crowding area in the cathode/chip side, and the (Cu,Ni)(6)Sn-5 IMC at the cathode/chip end was transformed into the Sn phase. The failure mechanism for Sn95/Sb5 flip chip solder joint is proposed in this paper.
URI: http://hdl.handle.net/11536/27415
ISSN: 0361-5235
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 32
Issue: 11
起始頁: 1278
結束頁: 1283
Appears in Collections:Conferences Paper


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