標題: Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package
作者: Huang, CS
Duh, JG
Chen, YM
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Sn-Ag solder;under-bump metallization;intermetallic compound;phase transformation;diffusion
公開日期: 1-Dec-2003
摘要: Several international legislations recently banned the use of Pb because of environmental concerns. The eutectic Sn-Ag solder is one of the promising candidates to replace the conventional Sn-Pb solder primarily because of its excellent mechanical properties. In this study, interfacial reaction of the eutectic Sn-Ag and Sn-Pb solders with Ni/Cu under-bump metallization (UBM) was investigated with a joint assembly of solder/Ni/Cu/Ti/Si(3)N(4)/Si multilayer structures. After reflows, only one (Ni,Cu)(3)Sn(4) intermetallic compound (IMC) with faceted and particlelike grain feature was found between the solder and Ni. The thickness and grain size of the IMC increased with reflow times. Another (Cu,Ni)(6)Sn(5) IMC with a rod-type grain formed on (Ni,Cu)(3)Sn(4) in the interface between the Sn-Pb solder and the Ni/Cu UBM after more than three reflow times. The thickness of the (Ni,Cu)(3)Sn(4) layer formed in the Sn-Pb system remained almost identical despite the numbers of reflow; however, the amounts of (Cu,Ni)(6)Sn(5) IMC increased with reflow times. Correlations between the IMC morphologies, Cu diffusion behavior, and IMC transformation in these two solder systems will be investigated with respect to the microstructural evolution between the solders and the Ni/Cu UBM. The morphologies and grain-size distributions of the (Ni,Cu)(3)Sn(4) IMC formed in the initial stage of reflow are crucial for the subsequent phase transformation of the other IMC.
URI: http://hdl.handle.net/11536/27355
ISSN: 0361-5235
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 32
Issue: 12
起始頁: 1509
結束頁: 1514
Appears in Collections:Conferences Paper


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