標題: Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner
作者: Lan, JK
Wang, YL
Liu, CP
Lee, WH
Ay, C
Cheng, YL
Chang, SC
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: shallow trench isolation;composite liner;circular defects
公開日期: 30-Jan-2004
摘要: This paper investigates. the monitor and elimination methods for the circular defects in high-density-plasma shallow trench isolation (HDP-STI) deposition process. The optical measurement method can monitor the circular defects in early stage. When the thickness of silane-burst film exceeds 7.8 nm, the fit-error can alert the circular defects. The oxynitride/oxide composite liner can eliminate the circular defects. Besides this, the oxynitride/oxide composite liner can also improve the breakdown strength of the STI oxide. The breakdown strength of the STI oxide increases, respectively, 375 and 30% in the wafer center and edge. The uniformity of the STI breakdown strength was reduced from greater than 200% to less than 10% using the composite liner. The traditional N2O plasma treatment for stabilizing the oxynitride film is harmful in the HDP-STI process. The N2O plasma treatment shows the worst circular defect performance. (C) 2003 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.tsf.2003.09.039
http://hdl.handle.net/11536/27124
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2003.09.039
期刊: THIN SOLID FILMS
Volume: 447
Issue: 
起始頁: 645
結束頁: 650
Appears in Collections:Conferences Paper


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