標題: Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned Cu
作者: Liu, Chien-Min
Lin, Han-Wen
Lu, Chia-Ling
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 19-Aug-2014
摘要: We investigate the growth of Cu films on two different Cu seed layers: one with regular < 111 >-oriented grains and the other with very strong < 111 >-preferred orientation. It is found that densely-packed nanotwinned Cu (nt-Cu) can be grown by pulsed electroplating on the strong < 111 >-oriented Cu seed layer without a randomly-oriented transition layer between the nt-Cu and the Cu seed layer. The electroplated nt-Cu grow almost epitaxially on the seed layer and formed < 111 >-oriented columnar structures. However, with the regular < 111 >-oriented Cu seed, there is a randomly-oriented transition layer between the nt-Cu and the regular < 111 >-oriented Cu seed. The results indicate that the seed layer plays a crucial role on the regularity of < 111 >-oriented nanotwinned Cu.
URI: http://dx.doi.org/10.1038/srep06123
http://hdl.handle.net/11536/25059
ISSN: 2045-2322
DOI: 10.1038/srep06123
期刊: SCIENTIFIC REPORTS
Volume: 4
起始頁: 0
結束頁: 0
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