標題: Grain growth in electroplated (111)-oriented nanotwinned Cu
作者: Huang, Yi-Sa
Liu, Chien-Min
Chiu, Wei-Lan
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Grain growth;Nanotwinned Cu;Preferred orientation;Electroplated Cu
公開日期: 15-Oct-2014
摘要: The grain growth of pulse-plated (111)-oriented nanotwinned Cu (nt-Cu) was investigated at 200-350 degrees C. The results indicate that after the annealing, the nt-Cu exhibits good thermal stability, and columnar grains with a (111)-oriented nt-Cu structure are maintained up to 300 degrees C. The columnar grains consume the original fine-grained region at the bottom of the sample. In addition, these fine grains were converted into nanotwinned columnar grains with a (111) orientation. The electroplated Cu film possessed extremely high (111) preferred orientation after the annealing. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.scriptamat.2014.06.008
http://hdl.handle.net/11536/25021
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2014.06.008
期刊: SCRIPTA MATERIALIA
Volume: 89
Issue: 
起始頁: 5
結束頁: 8
Appears in Collections:Articles


Files in This Item:

  1. 000340978400002.pdf