標題: Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization
作者: Chiu, Wei-Lan
Liu, Chien-Min
Haung, Yi-Sa
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 28-四月-2014
摘要: Cu3Sn intermetallic compounds (IMCs) are more resistant to fracture than solders. In addition, the Cu3Sn IMCs are more conductive than the solders. In this study, we manufactured Cu3Sn IMCs to serve as a joint using electroplated nanotwinned Cu as a metallization layer to react with pure Sn at 260 degrees C and 340 degrees C. The results show that there were almost no Kirkendall voids generated inside the Cu3Sn layer. In addition, the kinetics of the Cu3Sn growth was analyzed to predict the time needed to form the Cu3Sn joint. (C) 2014 AIP Publishing LLC.
URI: http://dx.doi.org/10.1063/1.4874608
http://hdl.handle.net/11536/24471
ISSN: 0003-6951
DOI: 10.1063/1.4874608
期刊: APPLIED PHYSICS LETTERS
Volume: 104
Issue: 17
結束頁: 
顯示於類別:期刊論文


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  1. 000336142500027.pdf