標題: Formation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressing
作者: Lin, C. K.
Liu, Chien-Ming
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Phase transformation;Metallic composites;Intermetallic compound;Solder;Electromigration
公開日期: 1-Jun-2014
摘要: This study examined the formation of Sn-rich phases in the matrix of Cu-Sn-Ni intermetallic compounds (IMCs) after current stressing of 1.2 X 104 A/cm(2) at 160 degrees C. The Sn-rich phases were formed at the cathode end of the solder joints with Cu metallization, and this formation was attributed to the decomposition of Cu6Sn5 IMCs. When the Cu6Sn5 IMCs were transformed into Cu3Sn during current stressing, Sn atoms were released. When the supply of Cu atoms became deficient, Sn atoms accumulated to form Sn-rich phases among the Cu-Sn-Ni IMCs. (C) 2014 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.matlet.2014.03.071
http://hdl.handle.net/11536/24400
ISSN: 0167-577X
DOI: 10.1016/j.matlet.2014.03.071
期刊: MATERIALS LETTERS
Volume: 124
Issue: 
起始頁: 261
結束頁: 263
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